industrial dicer
APX300
Vnation JSC

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With over 25 years industry experience fabricating semiconductors, Panasonic is pleased to introduce our latest plasma dicing solution: APX300. This machine is ideal for thin, brittle, and ultra-small die packages.
Achieve ultra-narrow dicing streets at 20?m for thin wafers down to 50?m.
And unlike blade dicing, plasma dicing will not induce edge chipping or surface layer stress damage related to mechanical heat.
Features & Benefits
Damage-free
Non-contact
Narrow aspect ratio of 2:1
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