plasma surface treatment machine / for wafers
V10-G
Vnation JSC

Contact us for advice solutions and equipment provider
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Type:
plasma
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Other characteristics:
for wafers
The batch system V10-G is designed for the removal of photoresists. Furthermore it can be optimally used for the cleaning of wafers.
Areas of application
Ideal system for removing photoresist layers (also SU-8) after dry processes like RIE or Ion Beam etching as well as after high dose implant processes
Silicon wafers or other substrate cleaning prior wet processing to achieve a better wettability for an uniform and efficient result
Applicable for processes in MEMS and nano technology
Polymer removal e.g. after Bosch processes
Removal of organic sacrificial layers
Conditioning of bioactive compounds
Products relative
Sand-blasting machines, sand-blasting cabinets, sand-blasting guns
Shot-blasting machines, shot-peening machines, shot-blasting booths
CNC polishing machines, belt sanders, bench grinders