backplane connector / square / SMT / high-performance

AirMax? family of connectors address the industry needs for high bandwidth applications requiring a scalable migration path to 25Gb/s data rate. This innovative edgecoupled connector utilizes a shieldless design with an air dielectric between conductors. AirMax? technology delivers signal densities up to 63.5 differential pairs per inch while exhibiting low insertion loss and low crosstalk, allowing signals to scale differential signals up to 25Gb/s.

Breaking the dependence on metal shields to accomplish excellent high speed electrical performance also provides incredible design flexibility. Individual contacts in a connector module are able to be allocated to differential signal pairs, single-ended signals or low-level power as dictated by the system need. The standard 2.0mm column spacing can be easily increased to 3.0mm enabling signal traces to be routed on a board layer, trading some signal density for reduced layer count and lower board cost for those applications that do not demand maximum signal density. The AirMax? system also provides flexibility in the number of differential pairs per column to address card slot pitch, connector profile or airflow requirements.

AirMax? extensive product variations accommodate a wide range of industry standard applications commonly used in backplane, midplane, coplanar, mezzanine, Cable-to-Board, and orthogonal midplane architectures.