coating thickness measurement and materials testing instrument

Fast, Accurate, and Reliable, the Proforma 300i wafer metrology system measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV).
Portable and Easy to Set Up, the Proforma 300i provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.

Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The non-abrasive coated wafer stage allows for easy positioning, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.

Ethernet and RS-232 port are provided for output to a personal computer.

Front USB port enables easy data storage to flash drives
Menu-driven for Fast, Easy Setup.
Proprietary Push-PullTM Probe Technology.
High-resolution LCD Display.
On-board Microprocessor for Accurate, Repeatable Measurements.
Bubble Level.
Adjustable Stage for Precise Leveling.

Measurements

Thickness
Total Thickness Variation (TTV)
Continuous and 5-point Measurement
Optional SEMI MF534-0707 Bow wafer ring

Advantages

Measures Different Materials, such as Si, Ge, InP, and GaAs*, Without Recalibration.
No Need to Electrically Ground the Wafer.
Easy to Set up and Operate - making it ideal for Statistical Process Control (SPC).
Provides High Performance at Low Cost.
Can be Customized for Maximum Sensing Range or Maximum Stand-off from Target.

*Gallium arsenide (GaAs) wafer material is only available with the Proforma 300Gi Model