in-line plasma cleaning system

The PSX307 plasma cleaner provides 1.5 times the operation of conventional models which corresponds plate chamber technology that delivers superior etch uniformity over conventional batch systems. It has Ultra-thin gold-plated electrodes can be wire bonded reliably without nickel compound formation via argon plasma treatment. Gold plating savings alone can provide ROI justification.

It is technically designed with a high-speed, uniform parallel plate plasma cleaner, a fast - up to 360 substrates/strips per hour and highly productive - inline processing for improved bonding, over molding and underfill semi S2/S8 compliant with Ar, O2 or mixed gas plasma