plasma engraving system / wafer / process / high-speed
9000 series
Vnation JSC

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Technique:
plasma
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Applications:
wafer, process
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Other characteristics:
high-speed
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X travel:
300 mm
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Y travel:
300 mm
Next generation devices at 20nm and below require double-patterning, 3D(three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi High-Tech developed the 9000 Series to support these next-generation processes.
The new HHT 9000 platform utilizes Hitachi?s proprietary low-contaminant, high-speed transfer system for high productivity.
The linked common platform permits process flexibility and future expansion through its modular chamber design.
Platform and user interface standardization will facilitate a smooth transition to 450-mm wafer sizes.
The 9000 platform incorporates HHT?s new microwave ECR(Electron Cyclotron Resonance) plasma etching chamber that is proven in high volume manufacturing usage.