PECVD deposition machine / sputtering / thin-film

Radiance is designed to make life easy with the flexibility to configure it just how you you need to enable your technology roadmap

Flexible process environments
Adjustable source to substrate separation, direct wafer or carrier handling with flexibility to processes different substrate sizes simultaneously, and up to 8 process gases with up or downstream process control

Proven process technologies
Production proven sputter sources with high rates and long target lifetimes mounted in a choice of single or batch modules according to your process requirements. Soft etch, heating and cooling capability come as standard to enhance your layer quality or protect your substrates

Process know how
From low temperature SiO2 deposition by PECVD, to high rate metalisation processes for power chips, plasma damage free dep and etch on GaN, and optical interference coatings, our applications specialist support, optical, optoelectronic and semiconductor processes.

Advanced Process Control (APC)
Here are just a few of the in-situ techniques available during deposition according to the application and process

Optical pyrometry, for temperature critical processes
Measurement of film electrical properties
Film stress measurement for thin wafers, high stress materials
Sputter process monitoring for reactive oxide processes
Broadband optical monitoring for the most accurate layer end point termination in optical and optoelectronic processes