backplane connector / board-to-board / rectangular / SMT

These ultra high density, high speed open pin field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050" pitch SEARAY? interconnects. With up to 500 total Edge Rate? contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 10 rows and 50 contacts per row, choice of 7 mm or 10 mm stack height, and high speed 28+ Gbps performance.The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.
FEATURES

0.80 mm (.0315") pitch grid
50% board space savings versus .050" (1.27 mm) pitch SEARAY?
Performance: Up to 17.5 GHz / 35 Gbps
Rugged Edge Rate? contact system
Up to 500 I/Os
7 mm and 10 mm stack heights
Solder charge terminations for ease of processing
Samtec 28+ Gbps Solution
Final Inch? certified for Break Out Region trace routing recommendations (Patent pending)